PART |
Description |
Maker |
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
081029132636 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸(16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu... ICSI[Integrated Circuit Solution Inc] Intersil, Corp.
|
R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
SES3V3D923-2U |
Small Body Outline Dimensions
|
Surge Components
|
DCC37S |
OUTLINE DIMENSIONS AND PANEL MOUNTING DETAILS
|
List of Unclassifed Manufacturers
|
TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
International Rectifier
|
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|